It seems that Samsung’s Heat Pass Block (HPB) technology, implemented in the Exynos 2600 SoC, is set to be adopted by other companies’ platforms. This information was shared by insider Fixed Focus Digital. Back in December, there were reports that Samsung was interested in opening up this technology to other firms. The insider now claims that apart from Samsung, the technology will also be utilized by many chip manufacturers commonly found in Android smartphones, most notably Qualcomm and MediaTek.
As a reminder, HPB technology essentially consists of a tiny copper block integrated into the chip. In the Exynos 2600 case, the placement of this heatsink can be seen in the diagram below. This approach enhances thermal characteristics and consequently allows frequencies to be increased if desired, making the platform faster.
Remember, Samsung is already working on the next version of such a solution named Side By Side (SbS). In this case, the concept involves placing the SoC die and DRAM chip side by side, rather than one on top of the other as is currently the norm. Then, everything will be covered with the HPB plate.
Previously, Fix Focus Digital shared details regarding the computer version of the HarmonyOS operating system, leaked photos of the new iPhone SE4, and renders of the Huawei Pocket 2, and also reported that Apple had ceased work on the foldable iPhone.
