The Ryzen Threadripper Pro 9995WX stands out as the most powerful processor that can be considered conditionally consumer-grade, marking a significant advancement from AMD in the evolving landscape of high-performance computing. Recently, a Chinese blogger by the name of Geekerwan conducted a compelling test of this CPU, not in its standard iteration, but with a custom-modified thermal spreader created specifically for a liquid cooling system. This daring modification leverages the technical intricacy of the Threadripper Pro’s inner architecture.
Collaborating with ASUS, the project’s developers initially sought to study the original thermal spreaders. To facilitate this, ASUS generously provided several legacy CPUs. This pivotal step allowed the team to fine-tune the design, including determining optimal microchannel depth, which is crucial for enhanced thermal dissipation.
The investigation led to the utilization of computer modeling, revealing that curved S-shaped microchannels optimized heat dissipation by a commendable 20% over simple straight grooves. Using a precision CNC milling machine, the researchers carved ultra-thin microchannels, just 0.15 mm in width with 0.3 mm spacing, demonstrating the pinnacle of micro-engineering.
This customized cooling solution facilitated a robust overclocking test. During the Cinebench benchmark, the Threadripper consumed approximately 1340W, maintaining temperatures between 30-50 degrees Celsius. The performance gain at 5.3 GHz was a robust 18%, showcasing incredible processing power for gamers and creative professionals alike.
For the gaming community and professionals, the Threadripper Pro 9995WX introduces unprecedented levels of computational efficiency and speed. This aligns perfectly with the demands of the latest 2026 gaming titles, such as those utilizing Unreal Engine 5, where high throughput and temperature management are key for seamless experiences.
Looking ahead, this innovative pairing of advanced processing capabilities with cutting-edge cooling design anticipates further developments. Industry experts suggest similar approaches could redefine the boundaries of thermal efficiency, directly influencing future CPU architectures and gaming hardware.
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