Intel and AMD Prepare for a CPU Battle Royale at CES 2026

We have already seen leaks about the new Intel Xeon 600 HEDT processors, and now a photo of the first motherboard for such CPUs has appeared online. Photo WCCF Tech. The ADLink ISB-W890 model looks quite simple compared to regular consumer models, but this is still a slightly different segment, and many decorative elements are absent here. However, the cooling of the power subsystem is also missing, yet the processors will have a TDP of 350 W.

This Intel CPU boasts 64 big cores and also includes Hyper-Threading support. Recently, there has been significant focus on AI acceleration capabilities in Intel’s Xeon processors, setting them apart in terms of machine learning and data processing tasks. Meanwhile, AMD’s Ryzen Threadripper PRO processors are recognized for their outstanding multi-threading performance, bringing fierce competition.

Regardless of that, you can see a very large socket, eight RAM slots, three full-sized PCIe slots, and four other variants. Also, there are two Slim SAS slots, two M.2 NVMe slots, and eight SATA III ports. It is expected that the new processors will be presented at the beginning of 2026, possibly at CES 2026 in January. The new lineup will include models up to 86 cores, and they will be competitors to the Ryzen Threadripper.

Industry analyses suggest that Intel’s enhanced thermal strategies aim to address the high thermal design power (TDP) challenges, ensuring efficient heat dissipation and maintaining performance under high-load conditions. Experts anticipate a head-to-head performance showdown with AMD’s offerings, particularly appealing to power users and enterprise environments.