In China, plans are underway to establish a homegrown production line for HBM3 memory, paving the way for swifter accelerators designed for AI applications. Reports suggest that CXMT, a leading entity in the local DRAM market, is gearing up to commence mass production of HBM3. While the exact launch date remains uncertain, CXMT aims to achieve this before year’s end. 
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Simultaneously, Chinese companies like Nowra Technology, Maxwell, and U-Precision are expediting the development of equipment crucial for assembling HBM stacks. HBM technology involves the layered arrangement of DRAM chips into stacks, necessitating cutting-edge processes. It’s expected that YMTC may later master HBM production, although they currently lag behind CXMT.
While AMD and Nvidia have transitioned beyond HBM3 to HBM3E and are currently preparing to employ HBM4 technology, HBM3 nevertheless offers commendable capabilities. Notably, the involvement of CXMT in HBM3 production could disrupt the global semiconductor landscape, sparking innovation and competition. As technological advancements continue at a brisk pace, China’s entry could have notable implications on market dynamics and tech evolution.
