At CES 2026, AMD unveiled its groundbreaking 2nm chips, marking a historic moment in semiconductor technology. These chips, aside from Samsung’s Exynos 2600 and partially Intel’s Core Ultra 300, represent the industry’s frontier. Notably, AMD’s initial deployment of this cutting-edge technology is aimed at server solutions, a strategic shift indicating the company’s focus on enterprise performance and efficiency.
AMD’s Epyc Venice server processors will boast up to 256 Zen 6C cores. The architecture will include up to eight CPU chiplets and two I/O chiplets. AMD promises more than a 70% boost in performance and energy efficiency, coupled with over 30% thread density improvement. Moreover, AMD will offer configurations with larger Zen 6 cores, maxing out at 192 cores spread across 16 chiplets, providing up to 768MB of L3 cache.
The company also showcased the Instinct MI455X accelerator. This component comprises two main GCD blocks, two MCD controllers, and 16 HBM4 memory chips. The Instinct MI450X has been previously reported to deliver 40 PFLOPS floating-point performance in FP4 mode and 20 PFLOPS in FP8, with an impressive 432GB of HBM4 memory.
The newly revealed chips will be integral to the Helios AI Rack platform. Similar to Nvidia, AMD aims to market entire turnkey rack systems to consumers.
While production of the new CPUs and GPUs has commenced, customers are expected to receive these products in the latter half of the year.
