In the wake of the AI boom, HBM3E memory prices have skyrocketed. According to the South Korean media outlet SEdaily, the cost of chips from leading manufacturers Samsung and SK Hynix has increased by 50%. When renewing contracts, companies are offering prices one and a half times higher than previous contracts, while new customers have to pay even more to access the scarce products.
Previously, a 12-layer HBM3E chip cost buyers around $300, but now the price has reached $500. The situation is exacerbated by limited production capabilities. Despite Samsung’s efforts to repurpose NAND flash memory lines for DRAM production, it’s challenging to quickly increase output. SK Hynix will also be able to boost supplies only in the second half of next year after launching a new plant. Therefore, the trend of rising high-speed memory prices is likely to continue into 2026.
The surge in demand is not surprising, considering the rapid advancements in AI technologies, which require these powerful memory chips for processing large datasets efficiently. Both Samsung and SK Hynix are responding by planning expansions and investing in new facilities to meet the rising demand. However, the industry currently faces challenges due to the intricate and time-consuming process of scaling production lines.
Looking forward, the industry anticipates further investments in R&D to develop more cost-effective and energy-efficient memory solutions. Experts suggest that these developments could mitigate some of the supply and pricing issues by 2026, but companies must first navigate the immediate production hurdles.
