While Western and Taiwanese giants are eager to integrate memory chips from the Chinese company CXMT into their PCs, CXMT itself is ambitiously moving forward with plans to initiate the production of HBM3 memory. This year, CXMT plans to expand its production capacity to 300,000 wafers per month. Approximately 20% of these will be allocated for the production of HBM3. This will mark China’s most advanced memory of this type produced domestically. The production of this relatively modern variant of HBM allows Chinese AI chip manufacturers to significantly enhance the performance of their solutions.
However, unlike Samsung, Hynix, and Micron, the Chinese company doesn’t plan to repurpose a majority of its production capabilities for HBM, restricting itself to just 20% of new capacities. Recently, CXMT announced further partnerships and technological advancements, which are expected to boost its global competitiveness. Industry experts note that this strategic decision positions CXMT as a formidable player in the competitive semiconductor market.
