Upcoming Innovations in Qualcomm’s Flagship SoCs
According to insider Digital Chat Station, Qualcomm’s forthcoming flagship single-chip platforms for smartphones, known by catalog numbers SM8975 and SM8750 (presumably Snapdragon 8 Elite Gen 6 Pro and Snapdragon 8 Elite Gen 6, respectively), will be exclusively manufactured by TSMC using the advanced 2-nanometer process. This marks a significant leap in process technology, promising improved performance and energy efficiency for future smartphone processors.
Discussions regarding the transfer of production to Samsung have not yet resulted in concrete agreements; however, this scenario has not been entirely ruled out. Previously, it was reported that Qualcomm completed the design of the Snapdragon 8 Elite Gen 5 version for Samsung’s 2nm GAA, and the Korean company has already sent chip samples for evaluation. If results meet Qualcomm’s standards, mass production of the Snapdragon 8 Elite Gen may be partially shifted to Samsung’s facilities.
Business and Technological Strategy
From a business perspective, it’s advantageous for Qualcomm to initiate collaboration with Samsung as early as possible. Rumor has it that the Snapdragon 8 Elite Gen 5 costs approximately $280 per unit, while the high cost of the Snapdragon 8 Elite Gen 6 Pro may reserve it only for the most expensive Android flagships. If two companies undertake SoC production, it could help Qualcomm reduce production costs and maintain margins in the future.
Advanced Specifications and Market Impact
Digital Chat Station has also revealed some technical details of the new SoCs: a CPU cluster of 2 + 3 + 3, unlike the 2 + 6 scheme in the Snapdragon 8 Elite and Snapdragon 8 Elite Gen 5; an Adreno 850 GPU; and LPDDR6 memory support by the senior model. Previously, Digital Chat Station was the first to accurately report the specifications of the Xiaomi 15 and Xiaomi 15 Pro, as well as that the Realme GT 7 Pro will have a bright Samsung screen and that the Dimensity 9400 SoC will arrive before the Snapdragon 8 Elite.
